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LTM8032
ABSOLUTE MAXIMUM RATINGS
(Note 1)
V IN , FIN, RUN/SS Voltage .........................................40V
ADJ, RT, SHARE Voltage .............................................5V
V OUT , AUX .................................................................10V
Current from AUX ................................................100mA
PIN CONFIGURATION
PGOOD, SYNC...........................................................30V
BIAS ..........................................................................25V
V IN + BIAS .................................................................56V
Maximum Junction Temperature (Note 2) ............ 125°C
Solder Temperature............................................... 245°C
A
1
2
TOP VIEW
3 4
V OUT
5
6
GND
7
A
1
2
TOP VIEW
3 4
V OUT
5
6
GND
7
BANK 1
B
C
D
E
BANK 1
B
C
D
E
BANK 2
F
G
H
RT
SHARE
BANK 2
F
G
H
RT
SHARE
AUX
AUX
BANK 3
J
K
L
V IN
BIAS
FIN RUN/SS SYNC
ADJ
PGOOD
BANK 3
J
K
L
V IN
BIAS
FIN RUN/SS SYNC
ADJ
PGOOD
LGA PACKAGE
71-LEAD (9mm × 15mm × 2.82mm)
T JMAX = 125°C, θ JA = 25.2°C/W, θ JCbottom = 10.3°C/W,
θ JCtop = 15.8°C/W, θ JB = 11.4°C/W, WEIGHT = 1.2g
θ VALUES DETERMINED PER JESD51-9
ORDER INFORMATION
BGA PACKAGE
71-LEAD (9mm × 15mm × 3.42mm)
T JMAX = 125°C, θ JA = 25.6°C/W, θ JCbottom = 11.0°C/W,
θ JCtop = 15.8°C/W, θ JB = 11.4°C/W, WEIGHT = 1.2g
θ VALUES DETERMINED PER JEDEC 51-9, 51-12
PART NUMBER
PAD OR BALL FINISH
PART MARKING*
DEVICE CODE
PACKAGE
TYPE
MSL
RATING
TEMPERATURE RANGE
(Note 2)
LTM8032EV#PBF
LTM8032IV#PBF
LTM8032MPV#PBF
LTM8032EY#PBF
LTM8032IY#PBF
LTM8032MPY#PBF
LTM8032MPY
Au (RoHS)
Au (RoHS)
Au (RoHS)
SAC305 (RoHS)
SAC305 (RoHS)
SAC305 (RoHS)
SnPb (63/37)
LTM8032V
LTM8032V
LTM8032MPV
LTM8032Y
LTM8032Y
LTM8032Y
LTM8032Y
e4
e4
e4
e1
e1
e1
e0
LGA
LGA
LGA
BGA
BGA
BGA
BGA
3
3
3
3
3
3
3
–40°C to 125°C
–40°C to 125°C
–55°C to 125°C
–40°C to 125°C
–40°C to 125°C
–55°C to 125°C
–55°C to 125°C
Consult Marketing for parts specified with wider operating temperature
ranges. *Device temperature grade is indicated by a label on the shipping
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
? Pb-free and Non-Pb-free Part Markings:
www.linear.com/leadfree
? Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures:
www.linear.com/umodule/pcbassembly
? LGA and BGA Package and Tray Drawings:
www.linear.com/packaging
8032fg
2
For more information www.linear.com/LTM8032
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